Formulation and Manufacturing Method of Electroplating Solution for Metal Plating
Published on: 2017/05/27
The electroplating solution for the production of iron-nickel-molybdenum soft magnetic alloy foil has the advantages of less environmental hazard, stable process, simple composition and easy operation, and can be stored for a long time after preparation. The Fe-Ni-Mo alloy foil with a thickness of 5-100 micron and an arbitrary length and width can be obtained by this plating process. The alloy foil is an excellent soft magnetic material with better comprehensive properties than molybdenum permalloy powder core (MPP), and its cost is much lower than that of molybdenum permalloy powder core (MPP). It has excellent temperature stability and can be applied to high quality factor Q filters, induction load coils and resonant electronics below 300 kHz. The circuit is used in LC circuit which requires high temperature stability, output inductance, power factor compensation circuit, etc.
First, the participation by Nanshan Branch, Baoan branch, Futian Branch, Luohu Branch, Yantian branch, Nanshan Branch, Longhua branch, Longgang branch, Guangming Branch, Pingshan Branch, Dapeng Branch Ii. Conference process 1. Chonghui Group introduces its experience and practice. 2. The public security management detachment reported the safety management problems of highly toxic and explosive dangerous chemicals and the investigation and punishment 3, Baoan branch made a statement 4. Speech by Comrade Xie Feng
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Chung hui introduced etching lead frame technology, in order to better cooperate with the customer diversification of the product type and product research and development to the problem of high cost, etching lead frame, cooperate with the customers products small size, high density, high precision products, the use of foreign advanced cleaning/sticker/exposure/etching equipment, stable performance of the equipment are high, to produce a product size precision is high. At the same time, these equipment in the industry's top companies have more than 10 years of successful operation experience.
The market size of China's IC design industry will reach 349.4 billion yuan in 2020, and is expected to reach 784.56 billion yuan in 2025. In the past five years, the compound growth rate of China's IC packaging and testing industry is 13.4%, far exceeding that of the world China's IC industry capacity is far behind the market scale, dependent on imports, chip localization urgent demand ------ Data sources: IC Insights, China Semiconductor Association, China General Administration of Customs