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Formulation and Manufacturing Method of Electroplating Solution for Metal Plating

Published on: 2017/05/27

The electroplating solution for the production of iron-nickel-molybdenum soft magnetic alloy foil has the advantages of less environmental hazard, stable process, simple composition and easy operation, and can be stored for a long time after preparation. The Fe-Ni-Mo alloy foil with a thickness of 5-100 micron and an arbitrary length and width can be obtained by this plating process. The alloy foil is an excellent soft magnetic material with better comprehensive properties than molybdenum permalloy powder core (MPP), and its cost is much lower than that of molybdenum permalloy powder core (MPP). It has excellent temperature stability and can be applied to high quality factor Q filters, induction load coils and resonant electronics below 300 kHz. The circuit is used in LC circuit which requires high temperature stability, output inductance, power factor compensation circuit, etc.

Domestic substitution is imperative, semiconductor industry chain ushered in a historic development stage

Electroplating workshop owner of direct row over standard heavy metal workshops was sentenced and fined

2023-11-18

First, the participation by Nanshan Branch, Baoan branch, Futian Branch, Luohu Branch, Yantian branch, Nanshan Branch, Longhua branch, Longgang branch, Guangming Branch, Pingshan Branch, Dapeng Branch Ii. Conference process 1. Chonghui Group introduces its experience and practice. 2. The public security management detachment reported the safety management problems of highly toxic and explosive dangerous chemicals and the investigation and punishment 3, Baoan branch made a statement 4. Speech by Comrade Xie Feng

Umc group express | | = core materials research and development of integrated circuits manufacturing project start ceremony of June

2022-09-02

The R&D and manufacturing project of SMIC integrated circuit materials was settled in Jiangmen High-tech Industrial Development Zone in October 2021, and the main construction body is SMIC Semiconduct

To meet customer demand, Chonghui Etching field, Etching smooth production

2022-02-18

Chung hui introduced etching lead frame technology, in order to better cooperate with the customer diversification of the product type and product research and development to the problem of high cost, etching lead frame, cooperate with the customers products small size, high density, high precision products, the use of foreign advanced cleaning/sticker/exposure/etching equipment, stable performance of the equipment are high, to produce a product size precision is high. At the same time, these equipment in the industry's top companies have more than 10 years of successful operation experience.

Domestic substitution is imperative, semiconductor industry chain ushered in a historic development stage

2022-01-18