+
  • QFN+Ag2.jpg

QFN+Ag

Classification:

QFN+Ag

Keywords:

QFN+Ag

Summary Description:

The combination offers outstanding performance in a truly innovative automotive-grade package, capable of replacing DPAK and D²PAK. the LFPAK56 offers significant space savings, design flexibility, reliability and uncompromised thermal performance compared to traditional D²PAK and DPAK solutions

Product Accessories:


Contact Us

Product description

The combination offers outstanding performance in a truly innovative automotive-grade package, capable of replacing DPAK and D²PAK. lFPAK56 offers significant space savings, design flexibility, reliability and uncompromised thermal performance compared to traditional D²PAK and DPAK solutions ● Thermal performance ▪ Copper clip technology ▪ High power density ▪ Small footprint area ● Ultra-low on-state resistance 0.9mOhm at 40V ■ No internal solder lines ■ Excellent performance ● Reliable and mass-producible ■ Excellent board-level reliability ■ Easy optical inspection ■ Strong solder joints ● High current rating ■ Current rating up to 220 A ■ Withstand instantaneous high currents ■ Resistant to strong current short circuits

Related Products


MESSAGE


If you have any questions, please feel free to send us a message!

Security verification
Submit
%{tishi_zhanwei}%