Ceramic Substrat
Classification:
Ceramic substrate
Keywords:
Ceramic Substrat
Summary Description:
The combination offers outstanding performance in a truly innovative automotive-grade package, capable of replacing DPAK and D²PAK. the LFPAK56 offers significant space savings, design flexibility, reliability and uncompromised thermal performance compared to traditional D²PAK and DPAK solutions
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Product description
The combination offers outstanding performance in a truly innovative automotive-grade package, capable of replacing DPAK and D²PAK. lFPAK56 offers significant space savings, design flexibility, reliability and uncompromised thermal performance compared to traditional D²PAK and DPAK solutions ● Thermal performance ▪ Copper clip technology ▪ High power density ▪ Small footprint area ● Ultra-low on-state resistance 0.9mOhm at 40V ■ No internal solder lines ■ Excellent performance ● Reliable and mass-producible ■ Excellent board-level reliability ■ Easy optical inspection ■ Strong solder joints ● High current rating ■ Current rating up to 220 A ■ Withstand instantaneous high currents ■ Resistant to strong current short circuits
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